Exhibition Recap | APE 2026 Singapore: Illuminating Optoelectronic Innovation, Empowering Industry Growth
Published:
2026-04-16
From February 4 to 6, 2026, the Asia Photonics Expo was held at the Marina Bay Sands Convention and Exhibition Centre in Singapore. C-Flink participated in this annual global gathering of the optoelectronics industry as an exhibitor, joining operators, equipment manufacturers, and industry partners from around the world to explore cutting-edge technologies and identify business opportunities.
Empowering Industry with Light
As a core platform connecting the global optoelectronics industry chain, APE 2026 brings together cutting-edge achievements in the field of optical communications. It not only showcases the latest industry trends but also provides exhibiting companies with channels for efficient networking and mutually beneficial cooperation. By participating in the Asia Photonics Expo (APE), we aim to leverage this leading industry platform to showcase our company’s technological capabilities and product strengths in the field of optoelectronic communications, thereby further enhancing our brand’s visibility and influence in both domestic and international markets. At the same time, we seek to engage in face-to-face exchanges with partners across the global industry chain—from upstream to downstream—to identify market trends and customer needs, broaden our channels for collaboration, and drive technological innovation and business implementation.
At the booth, C-Flink’s flagship 1.6T DAC, ACC, and AEC series of high-speed interconnect products took center stage — Designed for next-generation data centers, AI computing clusters, and ultra-high-speed communication scenarios, this series offers core advantages such as ultra-high bandwidth, low latency, high integration, and strong interference resistance. Supporting 1.6Tbps ultra-high-speed signal transmission, it features optimized upgrades in power consumption control, signal integrity, and physical dimensions, making it perfectly suited for demanding application environments such as AI servers, high-speed switches, and high-density data centers.
Thanks to its stable and reliable performance and flexible deployment options, the product has garnered widespread recognition and generated significant interest from numerous clients both domestically and internationally, fully demonstrating the company’s technical prowess and forward-thinking strategy in the high-speed interconnect sector. Our professional team provided detailed explanations to every visitor, covering everything from technical principles to practical applications, and from product advantages to customized solutions; each interaction reflected our deep respect for the industry and our unwavering commitment to our original mission.
During the exhibition, we engaged in in-depth discussions with clients from around the world and gained valuable insights. Not only did we attract a large number of industry professionals and potential clients for meaningful dialogue, but we also gained cutting-edge insights through in-depth exchanges with peers and experts. This has provided us with valuable resources and momentum for future product development, market expansion, and global growth.
Driven by Technology, Backed by Quality
Huizhou Jingzhao Lian Technology Co., Ltd. has been deeply involved in the high-speed interconnect field for nearly 25 years. As one of the first teams in China to develop DAC/AOC products, the company possesses strong core technical capabilities and has successfully surpassed the 1.6T ultra-high-speed barrier. It also offers full-cycle customized services with no minimum order quantity requirements, ensuring efficient and flexible response times.
Leveraging specialized automated production lines and a rigorous testing system, the company has obtained multiple authoritative certifications, including ISO 9001. With consistently stable and reliable product quality, its customer base spans high-end markets worldwide. The company continues to experience rapid business growth and is constantly upgrading its R&D capabilities. By building its core competitiveness on technology, experience, service, and quality, it provides high-performance interconnect solutions for data centers, AI computing, and other applications.
Moving Forward with Focus, Embracing the Future
Our memories of APE 2026 are of the bustling exhibition halls, the sincere exchanges, and, above all, our unwavering confidence in the future. Moving forward, we will carry these insights and our original aspirations with us as we continue to refine our technology and optimize our services, ensuring that optoelectronic technology better serves industries across the board. We look forward to meeting you again and joining you at the next grand celebration of light.
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Huizhou C-FLINK Technology Co.,Ltd.
Add：No. 7 Guangtai Road, Huinan High tech Industrial Park, Zhongkai High tech Zone, Huizhou
Tel：0752-3272990
Fax：0752-3288515
E-mail：sales01@c-flink.com
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