Scheme description
As AI clusters scale to unprecedented ten-thousand-card super-large scales, data exchange in distributed training surges dramatically. Bandwidth and latency bottlenecks are increasingly constraining the release of computing power, while the construction and O&M costs of intelligent computing centers are facing mounting pressure.
C-FLINK high-performance compatible AI high-speed interconnect products match the performance of original equipment and seamlessly adapt to in-rack and cross-rack networking scenarios. They ensure high-throughput and low-latency transmission for large model training and distributed inference. Without compromising cluster computing power or network reliability, these solutions reduce hardware procurement, expansion, and O&M investments, providing a cost-effective interconnect foundation for the deployment and operation of ultra-large-scale AI intelligent computing clusters.
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Huizhou C-FLINK Technology Co.,Ltd.
Add：6th Floor, Building DE, Jimi Industrial Park, No. 101 Jinfu Road, Xiaojinkou Subdistrict, Huicheng District, Huizhou, Guangdong, China
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