Scheme description
Amid the soaring thermal demands of today’s AI computing clusters and high‑density data centers, traditional air‑cooling falls short—delivering low heat‑removal efficiency and high energy consumption that cannot serve high‑power equipment. C-FLINK’s pluggable immersion liquid‑cooling wiring‑harness solution fits all immersion‑cooled data center scenarios, combining efficient heat dissipation, high‑speed interconnection, and easy O&M. It resolves the messy cabling, difficult disassembly/reassembly, and poor stability typical of legacy liquid‑cooling layouts, reliably sustaining high‑density compute devices above 500 W/U, and helping data centers cut costs, raise efficiency, and run greener and lower‑carbon.
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Huizhou C-FLINK Technology Co.,Ltd.
Add：No. 7 Guangtai Road, Huinan High tech Industrial Park, Zhongkai High tech Zone, Huizhou
Tel：0752-3272990
Fax：0752-3288515
E-mail：sales01@c-flink.com
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