Exhibition Review | C-Flink Presents Data Center Interconnection Solutions at ODCC
Published:
2026-09-14
Author:
September 2–4, the 2026 ODCC Open Data Center Conference & the 1st Computing Expo successfully concluded. Huizhou C-Flink Technology Co., Ltd. showcased at Booth A82, bringing high-speed copper cables, active optical cables, module series products and data center high-speed interconnection solutions tailored for AI intelligent computing. The company fully demonstrated its robust capabilities in short-reach high-density copper interconnection and long-distance optical fiber transmission, providing reliable support for efficient networking of AI clusters.
Industry Resonance: High-Speed Interconnection as a Key Enabler
Centered on the theme of "Open Computing Ecosystem, Token-enabled Inclusive Innovation", this year’s ODCC witnesses a fundamental shift in industrial competition from "pushing chip performance" to "system architecture capabilities". Against the backdrop of the routine deployment of large-scale computing clusters with ten thousand or one hundred thousand GPUs, networking latency, communication bandwidth and signal integrity have become core bottlenecks restricting the effective computing power release of clusters.
Data Center Interconnection Solutions
For the large-scale deployment of computing clusters in the AI intelligent computing era, C-Flink has built data center interconnection solutions covering the full speed range from 10G to 1.6T, based on its full-stack layout of three core product lines: high-speed copper cables (DAC/ACC/AEC), active optical cables (AOC), and pluggable modules.
- DAC High-Speed Copper Cable Series
In short-reach high-density interconnection scenarios within racks and between nodes, C-Flink's DAC high-speed copper cables deliver zero additional power consumption with their passive design, excellent EMI shielding and superior heat dissipation, making them the preferred choice for short-distance interconnection between AI computing servers and switches. Among them, the 1.6T OSFP224 series has successfully broken through the technical barrier of ultra-high-speed rates, adapting broadly to switches and computing servers and supporting efficient networking for AI clusters.
- AOC Active Optical Cable Series
For cross-rack and cluster scale-out long-reach expansion scenarios, C-Flink’s AOC active optical cable series covers mainstream speed grades from 10G to 800G. Featuring slim and lightweight cable construction, inherent anti-electromagnetic interference performance and extended transmission reach, it delivers stable and reliable optical interconnection support for HPC high-performance computing and cloud computing clusters.
- Pluggable Module Series
Complemented by the full-rate pluggable module series covering 10G–1.6T — spanning optical modules, electrical-port modules and loopback modules, with full compatibility across mainstream form factors including SFP/SFP-DD/DSFP/QSFP-DD, and supporting hot-swap and plug-and-play — C-Flink delivers a full-scenario interconnection product matrix for customers, from "copper" to "optical" and from "intra-node" to "inter-cluster".
C-Flink provides customized full-stack infrastructure solutions for data centers, backed by a complete portfolio of high-quality products and professional technical services. We support end-to-end services including architecture design, environment setup, testing and deployment. Featuring strong device compatibility, simple configuration and remote management capability, our solutions effectively streamline operation and maintenance workflows. With dual guarantees of "products + services", C-Flink meets the construction requirements of new-generation intelligent data centers.
Hand in Hand, Embark on a New Journey of Computing Power
During the three-day exhibition, C-Flink’s booth welcomed numerous clients and partners from the fields of data centers, cloud computing, servers, and semiconductor equipment. Featuring solutions ranging from 1.6T copper cable schemes and 800G long-reach AOC interconnection, to liquid-cooled wiring harnesses and professional solutions for semiconductor testing and other segmented scenarios, C-Flink conducted in-depth technical exchanges and explored in-depth cooperation opportunities with industry peers.
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