Successful Conclusion | C-Flink Debuts at CIOE, Embarking on a New Journey of Computing Interconnection
Published:
2026-09-16
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From September 9 to 11, the 27th China International Optoelectronic Exposition (CIOE) successfully concluded at the Shenzhen World Exhibition & Convention Center after three days. As an annual grand event for the global optoelectronics industry, this edition focused on the transformation of the optoelectronic sector amid the AI computing wave. C-Flink showcased its full portfolio of high-speed interconnection products at the show, engaging in face-to-face exchanges with new and existing clients as well as industry partners from home and abroad to explore technical trends in high-speed interconnection for data centers.
800G & 1.6T High-speed Interconnection Products Debut
With years of deep cultivation in the high-speed interconnection track, C-Flink specializes in the R&D, production, sales and service of DAC/ACC/AEC high-speed copper cable assemblies, AOC active optical cable assemblies and modules. We provide one-stop high-speed interconnection solutions for cloud computing, AI computing clusters, data centers, servers and HPC high-performance computing scenarios.
At this exhibition, C-Flink showcased its key products including 800G DAC, ACC and AEC high-speed copper cables, AOC active optical cables, as well as the 1.6T high-speed copper cable series for next-generation computing networks, demonstrating our technical expertise in high-bandwidth, low-power and low-latency high-speed interconnection.
High Booth Traffic | Exploring New Opportunities for Computing Interconnection
Ranging from mass-produced full-range 800G cables to forward-looking 1.6T interconnection products, C-Flink supports both standardized delivery and customized development. Tailored for diverse scenarios in the AI computing era, including short-range data center interconnection, cabinet wiring and liquid-cooled server supporting applications, our products attracted numerous industry customers for on-site consultations and in-depth business discussions.
At the exhibition, our technical and sales teams welcomed purchasers, solution integrators and equipment manufacturers from across the globe. Centering on industry hot topics driven by the AI computing boom, including cabling upgrades, domestic substitution, cost reduction and efficiency improvement, and interconnection solutions for liquid cooling, we had in-depth discussions with partners on product selection, project implementation and customized development. Many customers reached preliminary cooperation intentions on site, laying a solid foundation for follow-up project rollout.
Grateful for Your Trust, United for a Brighter Computing Future
The event has concluded, yet innovation continues. Driven by AI computing power, bandwidth demand keeps rising. As a critical component of the computing infrastructure, high-speed interconnects are embracing new development opportunities. Moving forward, C-Flink (Jingzhaolian) will continue to invest in R&D of high-speed interconnect technologies, steadily scale up the mass delivery of 800G products, accelerate the iteration and optimization of the 1.6T product portfolio, and continuously upgrade high-speed cable solutions. Committed to quality, we maintain flexible customization and reliable delivery capabilities, and keep supplying highly reliable, cost-effective high-speed interconnect products for global customers.
We are grateful to all customers and industry partners who visited our booth for exchanges, and thank you for your trust and support. Gather light in the Bay Area, connect computing power. We keep moving forward and look forward to meeting you again!
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Huizhou C-FLINK Technology Co.,Ltd.
Add：6th Floor, Building DE, Jimi Industrial Park, No. 101 Jinfu Road, Xiaojinkou Subdistrict, Huicheng District, Huizhou, Guangdong, China
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