Scheme description
In the production of semiconductor devices, it is necessary to go through dozens or even hundreds of processes from single wafer to final product. In order to ensure that the product performance is qualified, stable and reliable, and has a high yield, according to the production situation of various products, there should be strict specific requirements for all process steps. Therefore, it is necessary to establish the corresponding system and accurate monitoring measures in the production process, starting from the semiconductor process inspection.
There are many items, extensive contents and various methods of semiconductor process testing, which can be roughly divided into two categories. The first type is the detection of semiconductor wafers before and after or during each process, that is, the detection of semi-finished products or finished products of semiconductor devices and integrated circuits. The second type is the detection of raw materials, auxiliary materials, production environment, process equipment, tools, mask plate and other process conditions other than semiconductor single wafer.
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Huizhou C-FLINK Technology Co.,Ltd.
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